Contact Structure, Display Device and Electronic Device

ABSTRACT

A contact that takes a structure to laminate a protective conductive film over a metal film has a high hardness of the protective conductive film; therefore, a damage of contact surface made by contacting with an electrode of an inspection apparatus can be prevented in an inspection before boding FPC. However, the protective conductive film has higher resistivity compared to the metal film; therefore, contact resistivity with FPC gets higher, and power consumption gets bigger in the condition of using the display device. The present invention provides a contact structure, wherein a structure of FPC contact is formed of a layered film of the metal film and the protective conductive film, and a conductive particle included in an anisotropic conductive film is formed of the protective conductive film in a slit shape having a space wider than a width necessary for an electrical connection with the metal film and a space narrower than a width of an electrode of an inspection apparatus and can be electrically connected with the FPC in both of the protective conductive film and the metal film, and a display device having the contact structure.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a contact structure for connecting acircuit composed of a thin film transistor (hereinafter referred to asTFT) with a circuit over another substrate. Also, the present inventionrelates to a semiconductor device such as a display device utilizingsuch a contact structure. Especially, the present invention provides atechnique that can be appropriately utilized for a liquid crystaldisplay device and an electroluminescence (EL) display device thatprovided over one substrate a driving circuit set at a pixel portion andits periphery; a display device that formed together CPU, memory, dataprocessing circuit, and the like over one substrate with the device; andfurthermore, electronics that mounted these display devices. Note that,in the present specification, a display device refers to an overalldisplay device that operate by utilizing a characteristic of asemiconductor, and not only the liquid crystal display device and the ELdisplay device, but also the electronic device that mounted the displaydevice are included into its category.

2. Description of the Related Art

Conventionally, the contact has been mainly formed in a laminatedstructure of a metal film and a protective conductive film over asubstrate (for instance, Patent Document 1 can be referred) in the caseof connecting electrically a connection wiring over a substrate withanother wiring over a substrate by an anisotropic conductive film.

A method for connecting a substrate and a flexible printed circuit (FPC)is described using a cross-sectional view of a contact portion shown inthe Patent Document 1. As shown in FIG. 3, an FPC 104 is formed of asubstrate 105 and a wiring 106. A contact that laminates a metal film102 and a protective conductive film 103 is formed over a substrate 101.An interlayer insulating film 109 and a protective film 110 are formedon a periphery of the contact to protect the metal film 102. The contactover the substrate 101 and the wiring 106 over the FPC 104 are connectedby bonding using an anisotropic conductive film 107 that includesconductive particles 108.

[Patent Document 1] Japanese Patent Laid-Open No. 2001-93598

A circuit formed within a display device is performed an examinationbefore bonding the FPC using an inspection apparatus to confirmoperation of the display device in a process for manufacturing thedisplay device. As shown in FIG. 6, an inspection apparatus 322 iscomposed of an external driving circuit 323 for driving a display device311 with the purpose of inspecting; a measuring equipment 324 formeasuring an electric characteristic of the display device 311; and aninspection electrode 321 for electrically connecting the display device311, the external driving circuit 323, and the measuring equipment 324.

The inspection electrode 321 obtains an electric connection byphysically contacting with a contact 120 formed on an FPC contactportion 316 over the display device 311. A signal line driving circuit314 and a row select line driving circuit 315 formed within the displaydevice 311 are driven using the external driving circuit 323 included inthe inspection apparatus 322, and an electric characteristic of thesignal line driving circuit and the row select line driving circuit 315is measured using the measuring equipment 324 included in the inspectionapparatus 322.

A contact by the conventional technique takes a structure that laminatesthe protective conductive film over the metal film in order to preventcorrosion and oxidation of the metal film. The protective conductivefilm has a high hardness; therefore, the damage of a contact surface dueto a contact of the inspection apparatus 322 with the inspectionelectrode 321 can be prevented in the inspection during the process formanufacturing before bonding the FPC. However, the protective conductivefilm has high resistivity compared with that of the metal film;therefore, there is a problem that contact resistivity with the FPC getshigher and power consumption gets bigger in the condition of using thedisplay device.

SUMMARY OF THE INVENTION

It is an object of the present invention to decrease the contactresistivity between the contact and the FPC and to prevent the damage ofthe contact surface, which is the above problem.

In order to solve the above problem, following means is taken in thepresent invention. The present invention provides a contact structureincluding a connection wiring to connect electrically with a wiring overother substrate by an anisotropic conductive film, wherein theconnection wiring is formed of a laminated film of a metal film andprotective conductive film, and the protective conductive film has apattern in a slit shape in a connection part with the anisotropicconductive film.

In addition, the present invention provides a contact structureincluding a connection wiring to connect electrically with a wiring overother substrate by an anisotropic conductive film, wherein theconnection wiring is formed of a laminated film of a metal film andprotective conductive film, and the protective conductive film has apattern in a slit shape in a connection part with the anisotropicconductive film and electrically connected with the anisotropicconductive film in both of the protective conductive film and the metalfilm.

Furthermore, the present invention, wherein a part that the protectiveconductive film is not formed among a pattern in a slit shape of theprotective conductive film have a wider width than a space that isnecessary for an electric contact by a conductive particle included inthe anisotropic conductive film.

A display device of the present invention comprising a contact structurehaving one of a characteristic of the means.

BRIEF DESCRIPTION OF THE DRAWINGS

In the accompanying drawings:

FIG. 1 is an oblique perspective view illustrating a contact structureof the present invention;

FIG. 2 is a drawing illustrating a contact structure by the conventionaltechnique;

FIG. 3 is a drawing illustrating a connection between a contact and FPCusing an anisotropic conductive film;

FIG. 4 is a drawing illustrating a connection between a contact and FPCof the present invention using an anisotropic conductive film;

FIG. 5 is a drawing illustrating a contact between an inspectionelectrode of an inspection apparatus and a contact of the presentinvention;

FIG. 6 is a drawing illustrating an example of an inspection apparatusand a display device;

FIG. 7 is a drawing illustrating an example of a display device;

FIGS. 8A and 8B are examples of a circuit substrate connected by acontact portion having a contact structure of the present invention; and

FIGS. 9A to 9H are diagrams of electronic devices to which the presentinvention is applied.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment Modes ofthe Invention Embodiment Mode 1

A contact structure of the present invention is preferable for a displaydevice using a method for mounting that connects a circuit by ananisotropic conductive film, for instance, an active matrix type liquidcrystal display device and an EL display device. In FIGS. 2, 3 and 5,like components are denoted by like numerals as of FIG. 1 and FIG. 4.

The present embodiment mode is described referring to a display deviceincluding the signal line driving circuit and the row select linedriving circuit. In the display device 311 including the signal linedriving circuit 314, the row select line driving circuit 315, and apixel 313, the signal line driving circuit 314, the row select linedriving circuit 315, and the pixel 313 are connected electrically withan external apparatus of the display device 311 via the FPC, and it isnecessary to receive a power and a signal that is necessary for display.

The connection between the display device 311 and the FPC is carried outin the FPC contact portion 316 formed over the display device 311. TheFPC contact portion 316 is composed of a contact 120 formed with alaminated structure of a plurality of the metal films that is equallylined and a protective conductive film. The FPC contact portion 316 maybe placed at a plurality of places within the display device. FIG. 4 isa cross-sectional view taken along with A-A′ part of the FPC contactportion 316.

In FIG. 7, a signal of image to be displayed is transferred from the FPCcontact portion 316 to the signal line driving circuit 314 through avideo wiring 306, and transferred from the signal line driving circuit314 to each of pixels 313 included in a pixel portion 312 through asignal line 301. The scanning line driving circuit 315 and each ofpixels 313 are connected in a scanning line 304.

In the case of manufacturing the display device 311, an inspection iscarried out to distinguish whether the display device 311 isnondefective or defective. It is necessary condition that the signalline driving circuit 314 and the row select line driving circuit 315operate correctly so that the display device 311 including the signalline driving circuit 314 and the row select line driving circuit 315displays correctly.

In the case of carrying out separately an operation test of the signalline driving circuit 314 and the row select line driving circuit 315, itmay be during a process for manufacturing that the pixel 313 isuncompleted. Accordingly, a defective product can be found beforecompleting the display device 311 by inspecting at the point that thesignal line driving circuit 314 and the row select line driving circuit315 are advanced to a step capable for operating. Therefore, a rest of astep for manufacturing can be omitted and a cost for manufacturing canbe decreased.

As shown in FIG. 6, the inspection apparatus 322 is composed of theexternal driving circuit 323 for driving with the purpose of inspectingthe display device 311; the measuring equipment 324 for measuring anelectric characteristic of the display device 311; and the inspectionelectrode 321 for connecting the display device 311, the externaldriving circuit 323, and the measuring equipment 324.

The inspection electrode 321 can obtain an electric connection byphysically contacting with the contact 120 formed in the FPC contactportion over the display device 311. The signal line driving circuit 314and the row select line driving circuit 315 formed within the displaydevice 311 are driven using the external driving circuit included in theinspection apparatus, and an electric characteristic of the signal linedriving circuit 314 and the row select line driving circuit 315 ismeasured using the measuring equipment 324 included in the inspectionapparatus.

As shown in FIG. 2, the contact by the conventional technique laminatesthe protective conductive film 103 over the metal film 102 and takes astructure to cover a periphery of the metal film 102 with the protectivefilm 110 and the interlayer insulating film 109 to prevent the corrosionand the oxidation of the metal film 102. Furthermore, the protectiveconductive film 103 has a high hardness; therefore, the damage of thecontact surface formed by contacting with the inspection electrode 321damage of the contact surface formed by contacting with the inspectionelectrode 321 of the inspection apparatus 322 can be prevented in thecase of carrying out the operation at the point that the signal linedriving circuit 314 and the row select line driving circuit 315 areadvanced to a step capable for operating. However, a protectiveconductive film has a high resistivity; therefore, there is a problemthat the contact resistivity with the FPC gets higher and the powerconsumption gets bigger in the condition of using the display device.

In the present embodiment mode, difference between the contact structureof the prior art and that of the present invention is described usingFIG. 1 and FIG. 2. FIG. 1 shows an oblique perspective view enlarged aperiphery of the contact 120 placed at the FPC contact portion 316 inFIG. 7. FIG. 2 is a figure shown alike regarding the FPC contact portionformed by a conventional structure. A contact that laminated the metalfilm 102 and the protective conductive film 103 is formed over thesubstrate 101. The protective conductive film 103 is formed uniformlyover the metal film 102 in the conventional technique (FIG. 2), however,the protective conductive film 103 is formed in a slit shape in thepresent invention (FIG. 1).

In the present invention, the metal film 102 is not limited to a singlelayer. As an example of the metal film, a metal layer containing elementsuch as aluminum (Al); tantalum (Ta); titanium (Ti); molybdenum (Mo);and tungsten (W) as its main component, and an alloy layer including ametal element can be given. As the metal film, a conductive film formedwith material having conductivity and low resistivity may be also used.

In the present invention, the protective conductive film 103 is usedwith the purpose to protect the metal film 102, and it is preferable tobe material having conductivity and material having a higher hardnessthan that of the metal film 102 and strong in the oxidation and thecorrosion. As an example of the protective conductive film, indium oxideand indium tin oxide (ITO); indium zinc oxide; zinc oxide; and the likecan be given.

FIG. 4 is a cross-sectional view of the contact portion (A-A′ part ofFIG. 7) according to the present invention after bonding the FPC. Theanisotropic conductive film 107 including the conductive particle 108over the contact that is formed over the substrate 101 with the metalfilm 102 and the protective conductive film 103 is formed; therefore thecontact is electrically connected with the wiring 106 formed over thesubstrate 105 of the FPC 104.

FIG. 5 shows a cross-sectional view taken along with B-B′ part of FIG.6. The protective conductive film 103 has a slit shape and a width of apart that the protective conductive film 103 is not formed is formed tobe narrower than that of the inspection electrode 321 of the inspectionapparatus as shown in FIG. 5. It is also formed to be wider than a spacenecessary for an electrical connection between the metal film 102 by theconductive particle 108 included in the anisotropic conductive film 107and the wiring 106 of the FPC 104 as shown in FIG. 4.

The conductive particle 108 is squashed at boding the FPC; therefore,the width of the protective conductive film 103 that the protectiveconductive film 103 is not formed may not necessarily be wider than thatof a diameter of the conductive particle 108. A minimum width of theprotective conductive film 103 that the protective conductive film 103is not formed can get in a slit part that the protective conductive film103 is not formed in the condition that the conductive particle 108 issquashed and may be a width necessary for electrically contacting withthe metal film 102.

Both of the protective conductive film 103 formed in the slit shape andthe metal film 102 are contacted with the conductive particle 108 in theconnection part with the anisotropic conductive film 107 by forming theprotective conductive film 103 in the slit shape (FIG. 4). However, theinspection electrode 321 of the inspection apparatus is only contactedwith the protective conductive film 103 but not with the metal film 102(FIG. 5).

In the present embodiment mode, the display device 311 including thesignal line driving circuit 314, the row select line driving circuit315, and the pixel 313 of FIG. 7 is illustrated as an example. However,the present invention is also applicable to the display device that doesnot include the signal line driving circuit 314 and the row select linedriving circuit 315, and a display device that is formed together withCPU; memory; data processing circuit; and the like over one substrate inaddition to the signal line driving circuit 314 and the row select linedriving circuit 315.

Embodiment Mode 2

In the Embodiment Mode 2, an example of a substrate; an electroniccomponent; an electronic device; electronic equipment; and the likeconnected by the contact portion composed of the contact structure ofthe present invention and other conductor will be described using FIGS.8A and 8B.

In FIG. 8A, a circuit 802 and a contact portion 804 are formed togetherover a circuit substrate 801. The contact portion 804 shown in a wavyline takes a structure as shown in FIG. 4, and connected with the FPC803 in the contact portion 804.

Both of the protective conductive film and the metal film areelectrically connected with the conductive particle in the contactportion 804; therefore, it is possible to connect with other substratewithout involving the protective conductive film with high resistivity.Furthermore, the inspection electrode is not contacted directly withmetal of the contact portion even inspecting an electric characteristicof the circuit 802 is inspected by contacting the inspection electrodeat the contact portion before connecting the FPC as described inEmbodiment Mode 1. Therefore, the damage of the contact portion can beprevented.

In addition, a display device 806, and contact portions 809 and 810 aretotally formed over a substrate 805 in FIG. 8A, and a photodiode 807 inthe contact portion 809 and a IC (integrated circuit) in the contactportion 810 are connected.

Current detected in the photodiode is slight; therefore, such contactportion having low resistivity as in the present invention is extremelyeffective.

It should be noted that connected in the contact portion is not limitedto the circuit substrate 801 and the FPC 803; the substrate 805; thephotodiode 807; and the IC 808, and a printed substrate; a programmablelogic device substrate (FPGA (Field Programmable Gate Array) and CPLD(Complex Programmable Logic Device) may be capable. It may be electroniccomponent; an electronic device; an electronic appliance; and the likethat is connected in such a contact portion.

A structure connected with other conductor in the contact portion havingat the edge of the substrate as shown in FIG. 8A, and a structure havingother conductor over a substrate as shown in FIG. 8B can be combinedappropriately. The contact portion can be inspected without beingdamaged before connecting the conductor by having such a contactportion, and can save power consumption.

Both of the protective conductive film and the metal film areelectrically connected with the conductive particle by utilizing thepresent invention; therefore, it is possible to connect with othersubstrate without involving the protective conductive film with highresistivity. Furthermore, there is the protective conductive film with ahigh hardness in the surface of the contact; therefore, it can preventthe surface of the contact from being damaged by the inspectionelectrode of the inspection apparatus. Accordingly, the metal film canbe prevented from scrapping to be flown in all direction. In addition,the connect resistivity of the contact and the FPC can be decreased;therefore, it is possible to reduce the power consumption of the displaydevice.

Embodiment

Electronic devices to which the present invention is applied may begiven as a video camera, a digital camera, a goggles-type display (headmount display), a navigation system, a sound reproduction device (suchas a car audio device and an audio set), a lap-top computer, a gamemachine, a portable information terminal such as a mobile computer, amobile telephone, a portable game machine, an electronic book, and animage reproduction device including a recording medium (morespecifically, an device which can reproduce a recording medium such as adigital versatile disc (DVD) and so forth, and a display for displayingthe reproduced image), or the like. Specific examples thereof are shownin FIGS. 9A to 9H.

FIG. 9A illustrates an electronic device which includes a casing 2001, asupport table 2002, a display portion 2003, a speaker portion 2004, avideo input terminal 2005 and the like. When the light-emitting deviceis used for the display portion, the light-emitting device is of theself-emission-type and therefore requires no backlight. Thus, thedisplay portion thereof can have a thickness thinner than that of theliquid crystal display device. The electronic device is including theentire display device for displaying information, such as a personalcomputer, a receiver of TV broadcasting and an advertising display.

FIG. 9B illustrates a digital still camera which includes a main body2101, a display portion 2102, an image receiving portion 2103, operationkeys 2104, an external connection port 2105, a shutter 2106, and thelike.

FIG. 9C illustrates a lap-top computer which includes a main body 2201,a casing 2202, a display portion 2203, a keyboard 2204, an externalconnection port 2205, a pointing mouse 2206, and the like.

FIG. 9D illustrates a mobile computer which includes a main body 2301, adisplay portion 2302, a switch 2303, operation keys 2304, an infraredport 2305, and the like.

FIG. 9E illustrates a portable image reproduction device including arecording medium (more specifically, a DVD reproduction device), whichincludes a main body 2401, a casing 2402, a display portion A 2403,another display portion B 2404, a recording medium (DVD or the like)reading portion 2405, an operation key 2406, a speaker portion 2407 andthe like. The display portion A 2403 is used mainly for displaying imageinformation, while the display portion B 2404 is used mainly fordisplaying character information. The image reproduction deviceincluding a recording medium further includes a game machine or thelike.

FIG. 9F illustrates a goggle type display (head mounted display) whichincludes a main body 2501, a display portion 2502, an arm portion 2503,and the like.

FIG. 9G illustrates a video camera which includes a main body 2601, adisplay portion 2602, a casing 2603, an external connecting port 2604, aremote control receiving portion 2605, an image receiving portion 2606,a battery 2607, a sound input portion 2608, operation keys 2609, and thelike.

FIG. 9H illustrates a mobile telephone which includes a main body 2701,a casing 2702, a display portion 2703, a sound input portion 2704, asound output portion 2705, operation keys 2706, an external connectingport 2707, an antenna 2708, and the like. Note that the display portion2703 can reduce power consumption of the mobile telephone by displayingwhite-colored characters on a black-colored background.

When a brighter luminance of light-emitting materials becomes availablein the future, the light-emitting device will be applicable to afront-type or rear-type projector in which light including output imageinformation is enlarged by means of lenses or the like to be projected.

The aforementioned electronic devices are more likely to be used fordisplay information distributed through a telecommunication path such asInternet, a CATV (cable television system), and in particular likely todisplay moving picture information. Since the response speed of thelight-emitting materials is very high, the light-emitting device ispreferably used for moving picture display.

A portion of the light-emitting device that is emitting light consumespower, so it is desirable to display information in such a manner thatthe light-emitting portion therein becomes as small as possible.Accordingly, when the light-emitting device is applied to a displayportion which mainly displays character information, e.g., a displayportion of a portable information terminal, and more particular, amobile telephone or a sound reproduction device, it is desirable todrive the light-emitting device so that the character information isformed by a light-emitting portion while a non-emission portioncorresponds to the background.

As set forth above, the present invention can be applied variously to awide range of electronic devices in all fields. The electronic devicesin this embodiment can be obtained by utilizing the device having thecontact structure of the present invention.

1-6. (canceled)
 7. A semiconductor device comprising: a contact portionformed of a laminated layer of a metal film and a protective conductivefilm having a pattern in a slit shape; and a circuit substrate havingthe contact portion, wherein the contact portion is electricallyconnected with a terminal portion of a conductor.
 8. A semiconductordevice according to claim 7, wherein the circuit substrate having thecontact portion is electrically connected with a substrate.
 9. A circuitsubstrate according to claim 7, wherein the circuit substrate is aprogrammable device substrate or a printed substrate.
 10. Asemiconductor device comprising: a contact portion formed of a laminatedlayer of a metal film and a protective conductive film having a patternin a slit shape; and a circuit substrate having the contact portion,wherein the circuit substrate having the contact portion is electricallyconnected with a terminal portion of a conductor by an anisotropicconductive film in the contact portion; and wherein the metal film andthe protective conductive film of the contact portion are contacted withthe anisotropic conductive film.
 11. A semiconductor device according toclaim 10, wherein the circuit substrate having the contact portion iselectrically connected with a substrate.
 12. A semiconductor deviceaccording to claim 10, wherein the circuit substrate is a programmabledevice substrate or a printed substrate.
 13. A semiconductor devicecomprising: a contact portion formed of a laminated layer of a metalfilm and a protective conductive film having a pattern in a slit shape;and a circuit substrate having the contact portion; an anisotropicconductive film including a conductive particle, wherein the circuitsubstrate having the contact portion is electrically connected with aterminal portion of a conductor by the anisotropic conductive filmincluding the conductive particle, and wherein the metal film and theprotective conductive film of the contact portion are contacted with theanisotropic conductive film and the conductive particle.
 14. Asemiconductor device according to claim 13, wherein the circuitsubstrate having the contact portion is electrically connected with asubstrate.
 15. A semiconductor device according to claim 13, wherein thecircuit substrate is a programmable device substrate or a printedsubstrate. 16-29. (canceled)
 30. A display device comprising: a contactportion is formed of a laminated layer of a metal film and a protectiveconductive film in a slit shape; and an anisotropic conductive film,wherein the contact portion is electrically connected with a terminalportion of a conductor by the anisotropic conductive film; and whereinthe metal film and the protective conductive film of the contact portionare contacted with the anisotropic conductive film.
 31. A display deviceaccording to claim 30, wherein the contact portion is electricallyconnected with a substrate.
 32. A display device according to claim 30,wherein the contact portion is electrically connected with an externalwiring.
 33. A display device according to claim 30, wherein the contactportion is electrically connected with a flexible printed circuit.
 34. Adisplay device according to claim 30, wherein the contact portion iselectrically connected with a semiconductor integrated circuit.
 35. Adisplay device according to claim 30 wherein the display device is aliquid crystal display device.
 36. A display device according to claim30 wherein the display device is an electroluminescence display device.37. Electronic device using a display device according to claim
 30. 38.Electronic device according to claim 37, wherein the electronic deviceis a video camera, a digital camera, a goggles-type display, anavigation system, a sound reproduction device, a lap-top computer, agame machine, a portable information terminal, a mobile telephone, aportable game machine, an electronic book, or an image reproductiondevice including a recording medium.
 39. A display device comprising: acontact portion formed of a laminated layer of a metal film and aprotective conductive film having a pattern in a slit shape; and ananisotropic conductive film including a conductive particle wherein thecontact portion is electrically connected with a terminal portion of aconductor by the anisotropic conductive film including the conductiveparticle; and wherein the metal film and the protective conductive filmof the contact portion are contacted with the anisotropic conductivefilm and the conductive particle.
 40. A display device according toclaim 39, wherein the contact portion is electrically connected with asubstrate.
 41. A display device according to claim 39, wherein thecontact portion is electrically connected with an external wiring.
 42. Adisplay device according to claim 39, wherein the contact portion iselectrically connected with a flexible printed circuit
 43. A displaydevice according to claim 39, wherein the contact portion iselectrically connected with a semiconductor integrated circuit.
 44. Adisplay device according to claim 39 wherein the display device is aliquid crystal display device.
 45. A display device according to claim39 wherein the display device is an electroluminescence display device.46. Electronic device using a display device according to claim
 39. 47.Electronic device according to claim 46, wherein the electronic deviceis a video camera, a digital camera, a goggles-type display, anavigation system, a sound reproduction device, a lap-top computer, agame machine, a portable information terminal, a mobile telephone, aportable game machine, an electronic book, or an image reproductiondevice including a recording medium. 48-50. (canceled)
 51. A displaydevice according to claim 30, further comprising: a pixel portion havinga plurality of pixels placed in a matrix configuration; a first drivingcircuit that puts a signal in each pixel column of the pixel portion;and a second driving circuit that puts a signal in each pixel row of thepixel portion.
 52. A display device according to claim 39, furthercomprising: a pixel portion having a plurality of pixels placed in amatrix configuration; a first driving circuit that puts a signal in eachpixel column of the pixel portion; and a second driving circuit thatputs a signal in each pixel row of the pixel portion.
 53. Asemiconductor device according to claim 7, wherein the protectiveconductive film comprises a material selected from the group consistingof indium oxide, indium thin oxide, indium zinc oxide and zinc oxide.54. A semiconductor device according to claim 10, wherein the protectiveconductive film comprises a material selected from the group consistingof indium oxide, indium thin oxide, indium zinc oxide and zinc oxide.55. A semiconductor device according to claim 13, wherein the protectiveconductive film comprises a material selected from the group consistingof indium oxide, indium thin oxide, indium zinc oxide and zinc oxide.56. A semiconductor device according to claim 30, wherein the protectiveconductive film comprises a material selected from the group consistingof indium oxide, indium thin oxide, indium zinc oxide and zinc oxide.57. A semiconductor device according to claim 39, wherein the protectiveconductive film comprises a material selected from the group consistingof indium oxide, indium thin oxide, indium zinc oxide and zinc oxide.